LED flip chip bonder
LED flip chip mounting device
- Flip chip mounting of LED chips with a minimum size of 0.3mm on the substrate. - Bulk crimping of high-density, multi-point mounted LED chips using a large head.
- Company:大橋製作所 機器事業部
- Price:Other
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LED flip chip mounting device
- Flip chip mounting of LED chips with a minimum size of 0.3mm on the substrate. - Bulk crimping of high-density, multi-point mounted LED chips using a large head.